PARAMETER

POWER   VOLTAGE  CURRENT   CHIP MODEL   LED QTY   WAY OF SERIES   PCB'S SIZE   BEAM                                                                                                                         -PARALLEL                                   -ANGLE

100         30                3000         XTE/LG5W        30(PCS)     3P10S            231*2.0(mm)    5/10/20/30/60°

150         30                4500         XTL/XML2          30(PCS)     3P10S            231*2.0(mm)    5/10/20/30/60°

250         252              900           XTE/LG5W         84(PCS)    1P84S            400*2.0(mm)    5/10/20/30/60°

250         42                5400         XTE/LG5W         84(PCS)    6P14S            400*2.0(mm)    5/10/20/30/60°

500         252              1800           XML2                84(PCS)    1P84S            400*2.0(mm)     5/10/20/30/60°

500         42                10800         XML2                84(PCS)    6P14S            400*2.0(mm)     5/10/20/30/60°

By rich product range based on modular heatsink design with light weight and stable structure characteristics;using minimal weight to achieve maximum heat dissipation area for fastest cooling speed.

PROTECTION SURFACE TREATMENT

The whole structure has been treated with protection technology and undergone a 500-hour salt spray test,which boasts outstanding resistance to corrosion and rust and is thus adaptable to poor outdoor environment.

COMPRESSED FINS TECHNOLOGY

A new compressed fins technology from our supplier:rivet the heatpipe to heatsink body closely,minimize the heat resistance,greatly improve the heat dissipation effect,and it is much lighter compared with similar products.

HDT TECHNOLOGY

High efficient heatpipes contact the heat source directly,maxima the performance of the heatpipe to reach the cooling effect.

3-D HEAT DISSIPATION

Professional heat dissipation structure design.Modular heatsink with perfect structure and inside airflow channels maxim the 3D heat dissipation.